IPC-C-1000

IPC Essential Document Collection for Board Design, Assembly and Manufacture

発行日: June 2008

キットの内容： 広く使用されているIPC-A-600, IPC-A-610, J-STD-001、IPC-A-620など、

下記の102のドキュメントが含まれています。 (見積依頼書pdf)

HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Am

J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

4202: Flexible Base Dielectrics for Use in Flexible Printed Circuitry

4203: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and F

4204: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

4412A: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

4552: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

4553: Specification for Immersion Silver Plating for Printed Circuit Boards

4554: Specification for Immersion Tin Plating for Printed Circuit Boards

4562A: Metal Foil for Printed Board Applications

4563: Resin Coated Copper Foil for Printed Boards Guideline

4761: Design Guide for Protection of Printed Board Via Structures

4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend

4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed

4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe

5701: Users Guide for Cleanliness of Unpopulated Printed Boards

5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards

6011: Generic Performance Specification for Printed Boards

6012B: Qualification and Performance Specification for Rigid Printed Boards - Includes Amendment 1

6013A: Qualification and Performance Specification for Flexible Printed Boards with Amendment 2

7526: Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD

9201A: Surface Insulation Resistance Handbook

6018A: Microwave End Product Board Inspection and Test

9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Te

A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

A-600G: Acceptability of Printed Boards

AC-62A: Aqueous Post Solder Cleaning Handbook

CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

CH-65A: Guidelines for Cleaning of Printed Boards & Assemblies

D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

D-325A: Documentation Requirements for Printed Boards

D-422: Design Guide for Press Fit Rigid Printed Board Back Planes

DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

DR-572A: Drilling Guidelines for Printed Boards

HDBK-830: Guidelines for Design, Selection and Application of Conformal Coatings

ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print

J-STD-026: Semiconductor Design Standard for Flip Chip Applications

MS-810: Guidelines for High Volume Microsection

QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

SA-61A: Post Solder Semi-Aqueous Cleaning Handbook

SC-60A: Post Solder Solvent Cleaning Handbook

SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards

SM-839: Pre & Post Solder Mask Application Cleaning Guidelines

SM-840D: Qualification and Performance Specification of Permanent Solder Mask

TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress

TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

TR-583: An In-Depth Look At Ionic Cleanliness Testing

WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Prin

HDBK-001: Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001 B-C-D Comparisons)

WP-008: Setting Up Ion Chromatography Capability

2223B: Sectional Design Standard for Flexible Printed Boards

T-50H: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

3406: Guidelines for Electrically Conductive Surface Mount Adhesives

3408: General Requirements for Anisotropically Conductive Adhesives Films

7095B: Design and Assembly Process Implementation for BGAs

7351A: Generic Requirements for Surface Mount Design and Land Pattern Standard

9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects

9704: IPC/JEDEC Printed Wiring Board Strain Gage Test Guideline

A-610E: Acceptability of Electronic Assemblies

A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies

C-406: Design & Application Guidelines for Surface Mount Connectors

CA-821: General Requirements for Thermally Conductive Adhesives

CM-770E: Component Mounting Guidelines for Printed Boards

D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse

HDBK-005: Guide to Solder Paste Assessment

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

J-STD-001D: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

J-STD-003B: Solderability Tests for Printed Boards

J-STD-005: Requirements for Soldering Pastes - includes Amendment 1

J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders

J-STD-012: Implementation of Flip Chip & Chip Scale Technology

J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf

J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps

J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip and Other Mi

J-STD-033B: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

MC-790: Guidelines for Multichip Module Technology Utilization

S-816: SMT Process Guideline & Checklist

SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

SM-784: Guidelines for Chip-on-Board Technology Implementation

SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

SM-817: General Requirements for Dielectric Surface Mounting Adhesives

TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology

2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

2221A: Generic Standard on Printed Board Design

2222: Sectional Design Standard for Rigid Organic Printed Boards

2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

2226: Sectional Design Standard for High Density Interconnect (HDI) Boards

2251: Design Guide for the Packaging of High Speed Electronic Circuits

2252: Design Guide for RF/Microwave Circuit Boards

2316: Design Guide for Embedded Passive Device Printed Boards

2615: Printed Board Dimensions and Tolerances

4101B: Specification for Base Materials for Rigid and Multilayer Printed Boards - Includes Amendmen

4103: Specification for Base Materials for High Speed/High Frequency Applications

4104: Specification for High Density Interconnect (HDI) and Microvia Materials

4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar

4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl

DESCRIPTION

Need it all? IPC's largest document collection is offered at the largest discount　of all.

Create an instant library that includes all of the C-10X segment collections, plus selected additional documents.

Documents were reviewed and recommended for inclusion by IPC's technical staff.

Contains 102 documents, including the widely used IPC-A-600, IPC-A-610, J-STD-001 and IPC-A-620.

Take 60% off of individual document prices.