IPC-C-1000
IPC
Essential Document Collection for Board Design, Assembly and
Manufacture
発行日:
June 2008
キットの内容：
広く使用されているIPC-A-600,
IPC-A-610, J-STD-001、IPC-A-620など、
下記の102のドキュメントが含まれています。 (見積依頼書pdf)
HDBK-610:
Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D
Comparisons) with Am
J-STD-075:
Classification of Non-IC Electronic Components for Assembly Processes
4130:
Specification
& Characterization Methods for Nonwoven "E" Glass
Mat
4202:
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
4203:
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed
Circuitry and F
4204:
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed
Circuitry
4411A:
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
4412A:
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
4552:
Specification for Electroless Nickel/Immersion Gold
(ENIG) Plating for Printed Circuit Boards
4553:
Specification for Immersion Silver Plating for Printed Circuit Boards
4554:
Specification
for Immersion Tin Plating for Printed Circuit Boards
4562A:
Metal Foil for Printed Board Applications
4563:
Resin Coated Copper Foil for Printed Boards Guideline
4761:
Design Guide for Protection of Printed Board Via
Structures
4781:
Qualification and Performance Specification of Permanent, Semi-Permanent and
Temporary Legend
4811:
Specification for Embedded Passive Device Resistor Materials for Rigid and
Multilayer Printed
4821:
Specification for Embedded Passive Device Capacitor Materials for Rigid and
Multilayer Printe
5701:
Users Guide for Cleanliness of Unpopulated Printed Boards
5702:
Guidelines
for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed
Boards
6011:
Generic Performance Specification for Printed Boards
6012B:
Qualification and Performance Specification for Rigid Printed Boards - Includes
Amendment 1
6013A:
Qualification
and Performance Specification for Flexible Printed Boards with Amendment 2
7526:
Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD
9201A:
Surface Insulation Resistance Handbook
6018A:
Microwave End Product Board Inspection and Test
9691A:
User
Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF)
Resistance Te
A-142:
Specification for Finished Fabric Woven from Aramid
for Printed Boards
A-600G:
Acceptability of Printed Boards
AC-62A:
Aqueous
Post Solder Cleaning Handbook
CF-152B:
Composite Metallic Materials Specification for Printed Wiring Boards
CH-65A:
Guidelines
for Cleaning of Printed Boards & Assemblies
D-279:
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
D-325A:
Documentation Requirements for Printed Boards
D-422:
Design Guide for Press Fit Rigid Printed Board Back Planes
DR-570A:
General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed
Boards
DR-572A:
Drilling Guidelines for Printed Boards
HDBK-830:
Guidelines
for Design, Selection and Application of Conformal Coatings
ML-960:
Qualification and Performance Specification for Mass Lamination Panels for
Multilayer print
J-STD-026:
Semiconductor Design Standard for Flip Chip Applications
MS-810:
Guidelines
for High Volume Microsection
QF-143:
Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for
Printed Boards
SA-61A:
Post Solder Semi-Aqueous Cleaning Handbook
SC-60A:
Post
Solder Solvent Cleaning Handbook
SG-141:
Specification for Finished Fabric Woven from "S" Glass for Printed Boards
SM-839:
Pre & Post Solder Mask Application Cleaning Guidelines
SM-840D:
Qualification and Performance Specification of Permanent Solder Mask
TR-486:
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with
Thermal Stress
TR-579:
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in
PWBs
TR-583:
An In-Depth Look At Ionic Cleanliness Testing
WP/TR-584A:
IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants
in Prin
HDBK-001:
Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001 B-C-D
Comparisons)
WP-008:
Setting Up Ion Chromatography Capability
2223B:
Sectional Design Standard for Flexible Printed Boards
T-50H:
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
3406:
Guidelines for Electrically Conductive Surface Mount Adhesives
3408:
General Requirements for Anisotropically Conductive
Adhesives Films
7095B:
Design and Assembly Process Implementation for BGAs
7351A:
Generic Requirements for Surface Mount Design and Land Pattern Standard
9701A:
Performance Test Methods and Qualification Requirements for Surface Mount Solder
Attachments
9702:
IPC/JEDEC
Monotonic Bend Characterization of Board-Level Interconnects
9704:
IPC/JEDEC Printed Wiring Board Strain Gage Test Guideline
A-610D:
Acceptability of Electronic Assemblies
A-620A:
Requirements
and Acceptance for Cable and Wire Harness Assemblies
C-406:
Design & Application Guidelines for Surface Mount Connectors
CA-821:
General Requirements for Thermally Conductive Adhesives
CM-770E:
Component Mounting Guidelines for Printed Boards
D-326A:
Information Requirements for Manufacturing Printed Circuit Boards and Other
Electronic Asse
HDBK-005:
Guide to Solder Paste Assessment
JP002:
JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
J-STD-001D:
Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002C:
Solderability Tests for Component Leads, Terminations,
Lugs, Terminals and Wires
J-STD-003B:
Solderability Tests for Printed Boards
J-STD-005:
Requirements for Soldering Pastes - includes Amendment 1
J-STD-006B:
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid
Solders
J-STD-012:
Implementation
of Flip Chip & Chip Scale Technology
J-STD-020D-1:
IPC/JEDEC Moisture/Reflow Sensitivity Classification
for Nonhermetic Solid State Surf
J-STD-027:
Mechanical Outline Standard for Flip Chip and Chip Size Configurations
J-STD-028:
Performance
Standard for Construction of Flip Chip and Chip Scale Bumps
J-STD-030:
Guideline
for Selection and Application of Underfill Material
for Flip Chip and Other Mi
J-STD-033B:
Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices
MC-790:
Guidelines
for Multichip Module Technology Utilization
S-816:
SMT Process Guideline & Checklist
SM-780:
Component Packaging & Interconnecting with Emphasis on Surface Mounting
SM-784:
Guidelines
for Chip-on-Board Technology Implementation
SM-785:
Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
SM-817:
General
Requirements for Dielectric Surface Mounting Adhesives
TR-001:
An Introduction to Tape Automated Bonding Fine Pitch Technology
2141A:
Design Guide for High-Speed Controlled Impedance Circuit Boards
2221A:
Generic Standard on Printed Board Design
2222:
Sectional Design Standard for Rigid Organic Printed Boards
2225:
Sectional
Design Standard for Organic Multichip Modules (MCM-L)
and MCM-L Assemblies
2226:
Sectional Design Standard for High Density Interconnect (HDI) Boards
2251:
Design Guide for the Packaging of High Speed Electronic Circuits
2252:
Design Guide for RF/Microwave Circuit Boards
2316:
Design Guide for Embedded Passive Device Printed Boards
2615:
Printed Board Dimensions and Tolerances
4101B:
Specification
for Base Materials for Rigid and Multilayer Printed Boards - Includes Amendmen
4103:
Specification for Base Materials for High Speed/High Frequency Applications
4104:
Specification for High Density Interconnect (HDI) and Microvia Materials
4110:
Specification & Characterization Methods for Non Woven Cellulose Based Paper
for Printed Boar
4121:
Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board
Applications
CC-830B:
Qualification
and Performance of Electrical Insulating Compound for Printed Wiring Assembl
DESCRIPTION
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Documents
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Contains
102 documents, including the widely used IPC-A-600, IPC-A-610, J-STD-001 and
IPC-A-620.
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60% off of individual document prices.