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IPC-C-103
Electronics
Assembly Standards Collection
エレクトロニクス・アセンブリ規格コレクション
発行日:
June 2008
キットの内容：A-610Dなどエレクトロニクス製品のアセンブリーに関連する下記の36規格が含まれています。 (見積依頼書pdf)
J-STD-075:
Classification of Non-IC Electronic Components for Assembly
Processes
T-50H:
Terms and Definitions for Interconnecting and Packaging Electronic
Circuits
3406:
Guidelines
for Electrically Conductive Surface
Mount
Adhesives
3408:
General Requirements for Anisotropically Conductive Adhesives Films
7095B:
Design and Assembly Process Implementation for BGAs
7351A:
Generic Requirements for Surface
Mount
Design
and Land Pattern Standard
9701A:
Performance Test Methods and Qualification Requirements for Surface
Mount Solder Attachments
9702:
IPC/JEDEC
Monotonic Bend
Characterization of Board-Level Interconnects
9704:
IPC/JEDEC Printed Wiring Board Strain Gage Test Guideline
A-610D:
Acceptability
of Electronic Assemblies
A-620A:
Requirements and Acceptance for Cable and Wire Harness Assemblies
C-406:
Design
& Application Guidelines for Surface
Mount
Connectors
CA-821:
General Requirements for Thermally Conductive Adhesives
CM-770E:
Component Mounting Guidelines for Printed Boards
D-326A:
Information
Requirements for Manufacturing Printed Circuit Boards and Other
Electronic Asse
HDBK-005:
Guide to Solder Paste Assessment
JP002:
JEDEC/IPC
Current Tin Whiskers Theory and Mitigation Practices Guideline
J-STD-001D:
Requirements
for Soldered Electrical and Electronic Assemblies
J-STD-002C:
Solderability Tests for Component Leads, Terminations, Lugs,
Terminals and Wires
J-STD-003B:
Solderability
Tests for Printed Boards
J-STD-005:
Requirements
for Soldering Pastes - includes Amendment 1
J-STD-006B:
Requirements for Electronic Grade Solder Alloys and Fluxed and
Non-Fluxed Solid Solders
J-STD-012:
Implementation
of Flip Chip & Chip Scale Technology
J-STD-020D-1:
IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid
State
Surf
J-STD-027:
Mechanical
Outline Standard for Flip Chip and Chip Size Configurations
J-STD-028:
Performance
Standard for Construction of Flip Chip and Chip Scale Bumps
J-STD-030:
Guideline
for Selection and Application of Underfill Material for Flip Chip
and Other Mi
J-STD-033B:
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices
MC-790:
Guidelines
for Multichip Module Technology Utilization
S-816:
SMT Process Guideline &
Checklist
SM-780:
Component
Packaging & Interconnecting with Emphasis on Surface Mounting
SM-784:
Guidelines
for Chip-on-Board Technology Implementation
SM-785:
Guidelines for Accelerated Reliability Testing of Surface
Mount
Attachments
SM-817:
General
Requirements for Dielectric Surface Mounting Adhesives
TR-001:
An
Introduction to Tape Automated Bonding Fine Pitch Technology
CC-830B:
Qualification and Performance of Electrical Insulating Compound for
Printed Wiring Assembly
DESCRIPTION
It
takes a lot to be successful in electronics assembly: get the
reference documents you need on all aspects of the job from solder
materials, component characteristics, manufacturing and quality
requirements, and acceptability of the final assembly. Includes 36
key documents for SMT and through-hole assembly, including the
widely used IPC-A-610, J-STD-001 and IPC-A-620. Get the complete
collection and save 55% on individual document
prices.
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