IPC-C-103

Electronics Assembly Standards Collection

エレクトロニクス・アセンブリ規格コレクション

発行日: June 2008

キットの内容：A-610Dなどエレクトロニクス製品のアセンブリーに関連する下記の36規格が含まれています。　(見積依頼書pdf)

J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

T-50H: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

3406: Guidelines for Electrically Conductive Surface Mount Adhesives

3408: General Requirements for Anisotropically Conductive Adhesives Films

7095B: Design and Assembly Process Implementation for BGAs

7351A: Generic Requirements for Surface Mount Design and Land Pattern Standard

9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects

9704: IPC/JEDEC Printed Wiring Board Strain Gage Test Guideline

A-610E: Acceptability of Electronic Assemblies

A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies

C-406: Design & Application Guidelines for Surface Mount Connectors

CA-821: General Requirements for Thermally Conductive Adhesives

CM-770E: Component Mounting Guidelines for Printed Boards

D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse

HDBK-005: Guide to Solder Paste Assessment

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

J-STD-001D: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

J-STD-003B: Solderability Tests for Printed Boards

J-STD-005: Requirements for Soldering Pastes - includes Amendment 1

J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders

J-STD-012: Implementation of Flip Chip & Chip Scale Technology

J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf

J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps

J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip and Other Mi

J-STD-033B: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

MC-790: Guidelines for Multichip Module Technology Utilization

S-816: SMT Process Guideline & Checklist

SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

SM-784: Guidelines for Chip-on-Board Technology Implementation

SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

SM-817: General Requirements for Dielectric Surface Mounting Adhesives

TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology

CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembly

DESCRIPTION

It takes a lot to be successful in electronics assembly: get the reference documents you need on all aspects of the job from solder materials, component characteristics, manufacturing and quality requirements, and acceptability of the final assembly. Includes 36 key documents for SMT and through-hole assembly, including the widely used IPC-A-610, J-STD-001 and IPC-A-620. Get the complete collection and save 55% on individual document prices.